Bectron® SG 75 Series – 2-Part Addition Cure Silicones Gels
Bectron® SG 75 Series is a 2-part addition cure family of very soft materials. They cure at room temperature but it is possible
to accelerate the speed by heat. Thanks to their elastic properties and thermal resistance (from -45 °C up to 200 °C)
they are successfully used for potting power electronics like IGBT´s, sensible electronic devices and components against
mechanical stress and vibration.
Addition Cure
2-Part gel
Colour mixed viscosity
pot life
Penetration
thermal conductivity
UL
Resin
Hardener
mPas
min
mm*10
W/mK
internal
cure time
h@25°C
Bectron® SG
75V1-15
Bectron® SG
79V1-15
Clear-Clear 3.000 60 pen 15 0,20 V0 12
Bectron® SG
75V1-60
Bectron® SG
79V1-60
Clear-Clear 350 120 pen 60 0,20 V1 24
Bectron® SG
75V1-75
Bectron® SG
79V1-75
Clear-Clear 925 45 pen 75 0,20 V1 24
Bectron® SG
75L2-30
Bectron® SG
79L5-30
Beige-Blue 10.500 120 pen 30 0,90 V0 48
Bectron® SK 75 Series – 2-Part Addition Cure Silicones
Bectron® SK 75 is a 2-part addition cure family. For easy application all products were designed with very low viscosity.
Cure at room temperature takes 24h but it is possible to accelerate by heat. Thanks to their elastic properties and long
term thermal resistance (-40 °C to 200 °C) products are successfully used for encapsulation of electronic sensitive devices
for outdoor or harsh environment housings, power modules, etc. Products are flame retardant accordingly to UL 94.
Addition Cure
2-Part rubber
Colour mixed viscosity
pot life
Hardness
thermal conductivity
UL 94
cure time
Resin
Hardener
mPas
min
Shore
W/mK
internal
h@25°C
Bectron® SK
75V1-35*
Bectron® SH
79V2-35
White-Beige 990 180 A 35 0,30 V1 24
Bectron® SK
75V2-35
Bectron® SH
79V2-35
Beige-Blue 1.100 >180 A 35 0,30 V1 24
Bectron® SK
75V2-45
Bectron® SH
79V2-45
Beige-Beige 3.200 60 A 40 0,54 V0 24
Bectron® SK
75V2-65
Bectron® SH
79V2-65
Beige-Beige 3.500 60 A 65 0,45 V0 24
* self bonding after 1h@120°C
Bectron® SK 76 Series – 2-Part Condensation Cure Silicone
Bectron® SK 76 Series is a 2-part condensation cure family. They cure at room temperature. Thanks to their elastic properties
and long-term thermal resistance (from -40 °C up to 180 °C), our products are successfully used for PCB and other
components protection subject to thermal shock. They do not suffer for catalyst inhibition.
Condesation
Cure 2-Part
Colour mixed viscosity
pot life
Hardness
Cure
Hardener
mPas
min
Shore
Resin
thermal conductivity
W/mK
UL 94
internal
cure time
h@25°C
Bectron® SK
76V2-50
Betron® SH
79V5-50
Beige-Blue 2.600 30 A 50 0,40 n.a. 24
Bectron® SK
76V2-75
Bectron® SH
79V5-75
Beige-Blue 7.500 20 A 75 0,42 V1 6