Encapsulation / Potting
For High Performance
Polyurethane and Polybutadiene 2 part systems: BECTRON® PU 45.. and BECTRON®
PB 35.. family is comprised of 2 component Polyurethanes covering a clear, high transparency
resin and several filled resins. A range of viscosity, hardness and thermal resistance
characteristics are available with some qualified for UL94 -V0.
Polybutadiene containing resin of the BECTRON® PB 35.. range give additional flexibility which
persists at very low temperatures to withstand severe thermal cycling.
Polyurethane 1 part systems: The one component formulation of BECTRON® PK.. is ready
to use with no issues of mixing ratio or pot life and offers reliable performance with potentially
good environmental properties.
The resin system offers a range of viscosities with rapid heat cure to form a solid with one of
4 different hardness levels.
Silicone 2 part systems: BECTRON® SK75.. Silicones with Cross Linkers SH79.. provide 2
component systems with either addition and condensation chemistry and the advantage of
very high thermal resistance in a clear or filled material. They offer a choice of viscosities from
transparent gels to filled elastic silicone rubber with high thermal conductivity and UL94 V0.
These offer ideal protection for delicate electronic components.
Epoxy 2 part system: BECTRON® EP 55.. family with Hardeners EH59.. form 2-part epoxy
systems which cure to form elastic epoxy plastic. BECTRON® EP55.. is a solvent-less resin
with fillers and reacts with a modified aliphatic amine. The resin compound cures with low
volume shrinkage and heat evolution to give a stress-free resin. The high elasticity ensures
very favourable temperature cycling between -40 °C and +125 °C.
BECTRON® Encapsulation / Potting Resin
BECTRON® Encapsulation / Potting resins when cured display high elasticity and strength producing
excellent temperature cycling behaviour within the range of -50 °C to +200 °C as well as
resistance to vibrations. This ensures no crazing even in thick layered applications. Furthermore
all have good adhesion to almost all materials used in electronics.
Zero VOC / 100 % solids
Resistant to temperature cycling from -50 °C to +200 °C / 20.000 h
Low glass transition temperature
Vibration damping, high elasticity
No exotherm during curing
Minimal shrinkage
BECTRON® PU-Series 2 Component Polyurethanes, filled
Product
Code
Viscosity
mPas
UL 94 Max Temp.
ºC/20.000 h
PU 4512 900 No +110 ºC 70 A 40 24 60 0.15
PU 4513 750 No +115 ºC 75 A 50 24 75 0.36
PU 4515 4,500 No +150 ºC 80 A 15 8 30 0.15
PU 4516 310 No +125 ºC 50 D 55 16 60 0.20
PU 4522 1,800 V0 +125 ºC 85 A 20 8 30 0.48
PU 4526 1,900 V0 +130 ºC 55 D 25 14 50 0.45
PU 4537 1,600 V0 +130 ºC 64 D 30 24 120 0.74
PU 4539 4,000 V0 +130 ºC 56 A 40 24 40 0.70
BECTRON® 2 Component Silicones
Product
Code
Viscosity
mPas
UL 94
internal
Max. Temp.
°C/20.000h
SK 75V1-35/
SH 79V2-35
990 V1 200 35 A – 180
SK 75V2-45/
SH 79V2-45
3,200 V0 200 45 A – 60 24 0,54
SK 75V2-65/
SH 79V2-65
3,500 V0 200 65 A – 60 24 0,45
SG 75L2-30/
SG 79L5-30
10,500 V0 180 – 30 120 48 0,90
SG 75V1-15/
SG 79V1-15
3,000 V0 200 – 15 60 12 0,20
SG 75V1-60/
SG 79V1-60
350 V1 200 – 60 120 24 0,20
SG 75V1-75/
SG 79V1-75
925 V1 180 – 75 45 24 0,20
SK 76V2-50/
SH 79V5-50
2,600 – 180 50 A – 30 24 0,40
SK 76V2-75/
SH 79V5-75
7,500 V1 180 75 A – 20 6 0,42
ELANTAS Europe GmbH
Grossmannstr. 105 · 20539 Hamburg · Germany
Tel.: +49 40 78946 0 · Fax: +49 40 78946 360
Hardness
Shore
Pot Life
min
Cure h
@ +25 ºC
Cure min
@ +90 ºC
Thermal
Conductivity
W/mK
Hardness
Shore
Penetration
mm/10
Pot life
min
Cure Time
h@25 °C
Thermal
conductivity
W/mK
1h @
120 °C
E-Mail: bectron.elantas.europe@altana.com
Internet: www.elantas.com/europe
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